Customized product FCCL. High temperature resistant 320 degree PI copper coated film, with functions such as PI insulation and copper conductivity. The adhesive is coated with high-temperature resistant epoxy resin adhesive, and various specifications can be customized, such as:
Single panel PI13Um copper 13Um total thickness 40Um;
Single panel PI13Um copper 18Um total thickness 45Um;
Single panel Pl25Um copper 35Um, total thickness 75um;
Single panel Pl25um copper 18Um, total thickness 57Um;
Double sided board PI13Um copper 18Um total thickness 77Um;
Double sided board PI13Um copper 13Um total thickness 67Um,
Double sided board PI25Um copper 18Um total thickness 89Um;
Double sided board Pl25um, copper 35um, total thickness 123um;
Double sided board PI25um copper 50um with a total thickness of 95um.
Flexible Copper Clad Laminate (FCCL), also known as Flexible Copper Clad Laminate, Flexible Copper Clad Laminate, or Flexible Copper Clad Laminate, is the processing substrate for Flexible Printed Circuit Board (FPC).
1. Classification
Soft copper foil substrates (FCCL) can be divided into two categories: traditional three-layer soft plate substrates with adhesive dosage forms (3L FCCL) and new two-layer soft plate substrates without adhesive dosage forms (2L FCCL).
It is composed of a flexible insulation base film and metal foil, and is composed of three different materials: copper foil, thin film, and adhesive. The flexible copper clad plate is called a three-layer flexible copper clad plate (referred to as "3L-FCCL"). Flexible copper clad plates without adhesive are called two-layer flexible copper clad plates (referred to as "2L-FCCL").
Because the manufacturing methods of these two types of soft copper foil substrates are different, the material properties of the two types of substrates are also different. In terms of application, the application product projects of the two types of FCCLs are different. 3L-FCCL is applied to bulk soft board products, while 2L FCCL is applied to higher-order soft board manufacturing, such as soft and hard boards, COF, etc. Due to the high price of 2L FCCL and insufficient production capacity to meet the demand for higher-order soft boards, many domestic and foreign manufacturers have invested in the production of 2L FCCL, but there are still problems of slow output speed and low yield.
2. Product composition
The composition of flexible copper clad plate mainly includes three types of materials: insulation substrate material: the insulation substrate material used for flexible copper clad plate includes polyester (PET) film, polyimide (PI) film, polyimide film, fluorocarbon ethylene film, amide fiber paper, polybutene phthalate film, etc. Among them, polyester film (PET film) and polyimide film (PI film) are currently the most widely used.
Metal conductor foil
Metal conductor foil is a conductor material used for flexible copper clad laminates, including copper foil (ordinary electrolytic copper foil, high ductility electrolytic copper foil, rolled copper foil), aluminum foil, and copper beryllium alloy foil. The vast majority use copper foil, including electrolytic copper foil (ED) and rolled copper foil (RA).
adhesive
Adhesive is an important component of three-layer flexible copper clad laminate, which directly affects the product performance and quality of flexible copper clad laminate. The main adhesives used for flexible copper clad panels include polyester adhesives, acrylic adhesives, epoxy or modified epoxy adhesives, polyimide adhesives, phenolic butyraldehyde adhesives, etc. In the three-layer flexible copper clad panel industry, adhesives are mainly divided into two schools: acrylic adhesives and epoxy adhesives.
classification
DuPont single sided FCCL.
Single sided three-layer flexible copper clad plate product (DuPont, size 0.6 × 0.9m).
Double sided three-layer flexible copper clad plate product (DuPont, size 0.6 × 0.9m).
3. Common varieties
It includes: PI coating film, PET coating film, polyester coating film, polyimide coating film, acrylic coating film, acrylic coating film, epoxy resin coating film, single-sided copper foil substrate, double-sided copper foil substrate, electrolytic copper foil substrate, rolled copper foil substrate, PI film substrate, PET film substrate, PVC film substrate, PEN film substrate, polyimide copper foil substrate, polyester copper foil substrate, polyvinyl chloride copper foil substrate PTFE copper foil substrate, adhesive free copper foil substrate, double-sided copper foil adhesive free substrate, single-sided copper foil adhesive free substrate, acrylic pure film, acrylic pure film, epoxy resin pure film.
Common thickness of covering film: 25 μ m. 30 μ m. 35 μ m. 36 μ m. 38 μ m. 40 μ m. 42 μ m. 50 μ m. 60 μ m. 75 μ m. 80 μ m. 100 μ m. 115 μ m. 120 μ m. 125 μ m. 160 μ m. 320 μ M.
The commonly used widths of the covering film are 120mm, 130mm, 150mm, 250mm, 260mm, 270mm, 280mm, 300mm, 304mm, 305mm, 310mm, 330mm, 450mm, 500mm, 510mm, 550mm, 600mm, 610mm, 630mm, 750mm, 800mm, 810mm, 1220mm, 1300mm.
Common lengths of covering film: 250mm, 300mm, 305mm, 420mm, 450mm, 500mm, 600mm, 610mm, 630mm, 750mm, 800mm, 810mm, 1220mm, 1300mm, 25M, 27.4M, 50M, 100M, 600M, 1000M.
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