Customized product FCCL. High temperature resistant 320 degree PI copper coated film, with functions such as PI insulation and copper conductivity. The adhesive is coated with high-temperature resistant epoxy resin adhesive, and various specifications can be customized, such as:
Single panel PI13Um copper 13Um total thickness 40Um;
Single panel PI13Um copper 18Um total thickness 45Um;
Single panel Pl25Um copper 35Um, total thickness 75um;
Single panel Pl25um copper 18Um, total thickness 57Um;
Double sided board PI13Um copper 18Um total thickness 77Um;
Double sided board PI13Um copper 13Um total thickness 67Um,
Double sided board PI25Um copper 18Um total thickness 89Um;
Double sided board Pl25um, copper 35um, total thickness 123um;
Double sided board PI25um copper 50um with a total thickness of 95um.
FPC flexible circuit boards are generally bonded with thermosetting adhesive and reinforcing boards. The thermosetting adhesive is solid at normal
temperature and has no viscosity. However, when the temperature rises to a certain extent, it will transform into a semi cured state with strong
viscosity, at which point the FPC will adhere to the reinforcing plate. The general practice is to align the reinforcement with the fitting position and
use an electric soldering iron to heat it for 1-2 seconds to achieve a single point positioning effect. Afterwards, hot pressing, i.e. high temperature
and pressure, is performed to allow the entire adhesive to flow and bond thoroughly, and at this point, it is basically bonded. After further baking,
further solidify the adhesive. The FPC reinforcement plate requires size during bonding, with neat and uniform edges without burrs, a flat surface
without obvious defects or foreign objects, and a consistent color. The process must be indicated on the process sheet for bonding and reinforcing
the board. The bonding drawing for the reinforcing board includes the FPC appearance, the reinforcing appearance, and the bonding positions of the two.
GROWING PI reinforcement plate pressure transmission process conditions:
1. Band: temperature 120 ºC, pressure 20kg/cm2, time 1min;
2. Second band: temperature 140 ºC, pressure 30kg/cm2, time 80min;
3. The third band: temperature 80 ºC, pressure 30kg/cm2, time 5min;
Precautions for PI reinforcement board operation
PI must be reinforced and baked at 80 ºC for 30 minutes before use.
Suggested working environment: 25 ° C, 65% RH.
The PI reinforcement plate after cutting should be used in a timely manner. If the detention period exceeds 1 day, the reinforcement should be sealed and stored.
During the operation, attention must be paid to the cleanliness and pre-treatment of the interface between FPC and reinforcement materials.
When using different pressing systems, attention must be paid to the operation of pressing conditions and the differences in use.
After the PI reinforcement board is matured and baked, it should wait for the fixture to cool before releasing the fixture to remove the product.
The PI reinforcement plate after pressing is not prone to rapid cooling. If using a fast press, the product after pressing should be placed on a carrier such as glass fiber cloth with slower heat transfer effect after being taken out; If using a press, wait for the product to cool to room temperature.
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