High Temperature and Corrosion Resistance Pi Gold Finger Polyimide Film Kapton

• Customization: Available
• Structure: Single-Sided FPC
• Material: Polyimide
• Model NO.: FPC8002
• Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
• Conductive Adhesive: Anisotropic Conductive Adhesive
• Flame Retardant Properties: V0
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Size: 250mm
• Transport Package: 100m/Roll
• Specification: 520/660/910/1040
• Origin: China
• HS Code: 74102110
• Production Capacity: 800000m2/Month

Product Description

 Customized product FCCL/CVL.Flexible copper clad laminate are widely used in electronic products such as aerospace equipment, navigation

equipment, aircraft instruments,  and mobile phones, digital cameras, digital cameras, automotive satellite directional

positioning devices, LCD TVs, laptops, etc. Flexible Copper Clad Laminate (FCCL) (also known as Flexible Copper Clad Laminate) is a processing

substrate material for Flexible Printed Circuit Board (FPC), which is composed of a flexible insulation substrate film and metal foil. The flexible copper

clad plate composed of three different materials: copper foil, thin film, and adhesive is called a three-layer flexible copper clad laminate (referred to as

"3L-FCCL"). Flexible copper clad laminate without adhesive are called two-layer flexible copper clad laminate (referred to as "2L-FCCL").

Flexible copper clad laminate (FCCL) has the characteristics of being thin, lightweight, and flexible compared to rigid copper clad panel in terms of

product characteristics. FPC using FCCL as the substrate material is widely used in electronic products such as mobile phones, digital cameras, digital

cameras, automotive satellite directional positioning devices, LCD TVs, laptops, etc.